Description: The objective of this course is to sensitize the undergraduate students and graduate students to the all-important multidisciplinary area of electronics systems packaging. The course will discuss all the important facets of packaging at three major levels, namely, chip level, board level and system level. The entire spectrum of microelectronic systems packaging from design to fabrication; assembly and test will be covered. Current trends in packaging of electronic systems will be covered.
Resources: OpenCourseware from NPTEL (India), Sheridan College, MIT, UC Berkeley, Stanford & many other of the World's finest University's.
Professors: Michael Williams