Description: This interdisciplinary course not only gives an overview of the micro and smart systems technologies but also gives an in-depth understanding of the issues involved. It begins by answering the important question: why miniaturize? This is followed by a quick summary of a variety of sensors, actuators, and systems. It then presents a comprehensive description of microfabrication. This is followed by a detailed discussion of mechanics of solids as it pertains to micro and smart systems. While this part may be viewed as strength of materials and design, an effort is made to relate this to micro devices and discuss such topics as residual stress and stress gradients, lumped modeling using energy methods, anticlastic curvature, etc. The discussion ends with general equations of elasticity and their solution is discussed next using the finite element method. Here, too the basics and advanced topics are interleaved to provide a thorough understanding of the finite element method. After this, electronics circuits, control, and packaging are also presented.
Resources: OpenCourseware from NPTEL (India), Sheridan College, MIT, UC Berkeley, Stanford & many other of the World's finest University's
Professors: Michael Williams